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Path Catalog
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This advanced graduate-level learning path equips learners with the knowledge to critically evaluate 2D materials for future electronic devices. It covers fundamental concepts of 2D materials, their electronic properties, and the challenges in device integration, culminating in a framework for comparative assessment.
This learning path provides a structured approach to understanding semiconductor packaging technologies, from foundational concepts to advanced 3D integration. It covers wire bonding, flip-chip, wafer-level packaging, thermal management, and 3D integration, with emphasis on material properties and process principles.
This learning path provides professional engineers with a deep understanding of the materials science and engineering principles underlying major memory technologies, including DRAM, SRAM, flash, phase-change, and ferroelectric memories. It covers fundamental semiconductor physics, key material properties, and processing considerations, enabling learners to evaluate and select appropriate materials for memory device design and manufacturing.
This learning path equips professional engineers with the knowledge and skills to conduct failure analysis on semiconductor devices. It covers device physics fundamentals, failure modes and mechanisms, fault isolation techniques, and advanced characterization methods including FIB, SEM, TEM, and EDS. The path emphasizes practical application and hands-on techniques essential for a career in failure analysis.
This advanced professional learning path equips engineers with the knowledge to apply reliability tests to semiconductor devices, focusing on ESD, latch-up, hot carrier injection, negative bias temperature instability, and accelerated testing. It builds on advanced device physics to understand failure mechanisms, test methods, and qualification standards.
This learning path guides undergraduate engineering students through the fundamental principles of cleanroom design, focusing on particle control, contamination sources, classification standards, and gowning protocols. It builds from basic semiconductor fabrication concepts to the specific engineering requirements of cleanrooms, preparing learners for careers in semiconductor manufacturing.
This learning path equips undergraduate engineering students with the knowledge to analyze yield and reliability issues in semiconductor production. It covers essential concepts from semiconductor processing and defects through yield modeling, failure mechanisms, burn-in, and lifetime prediction.
This learning path equips undergraduate engineering students with the knowledge to understand how metallic interconnects are deposited and patterned in semiconductor manufacturing. It covers thin film fundamentals, key deposition techniques (sputtering, evaporation, electroplating, CVD), barrier layers, and the damascene process, emphasizing the materials science and process integration aspects.
This learning path guides undergraduate engineering students through the photolithographic process used in semiconductor manufacturing. It covers essential concepts from wafer preparation and photoresist chemistry to mask alignment, exposure systems, and etching techniques, providing a solid foundation for understanding how integrated circuits are patterned.
This learning path provides a comprehensive understanding of the wafer fabrication process, from silicon crystal growth to final inspection. It covers the essential steps of crystal growth, wafer preparation (slicing, lapping, polishing, cleaning), and inspection, emphasizing the material science and engineering principles behind each stage. Designed for undergraduate engineering students, the path builds a solid foundation in semiconductor materials and processing.