Learning Path

Metallization and Interconnect Technology

Thin Film Growth Fundamentals → Copper vs. Tungsten Interconnects

11 Knowledge Nodes · 11 Learning Steps · v0 Active

This learning path equips undergraduate engineering students with the knowledge to understand how metallic interconnects are deposited and patterned in semiconductor manufacturing. It covers thin film fundamentals, key deposition techniques (sputtering, evaporation, electroplating, CVD), barrier layers, and the damascene process, emphasizing the materials science and process integration aspects.

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11 nodes18 edges3 relationships

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Learning Route

11 learning steps · 3 phases. Click any step to inspect it and see it on the Knowledge Map.

Phase 1

Foundation

4 steps

Phase 2

Core Concepts

4 steps

Phase 3

Advanced Topics

3 steps